Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
BTU Releases the Next-Generation Reflow Oven Platform – Aurora
April 24, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the release of its newest reflow oven platform. Aurora is leading the way to the factory of the future by seeing reflow in a new light.
Aurora, the newest reflow oven platform, is designed based on years of expertise and leadership from BTU, the makers of the industry’s best performing reflow ovens. As the latest in a long line of world-class thermal systems, Aurora has quality and innovation in its DNA.
“It has always been the goal of BTU International to enable our customer’s success – and we’ve packed this new reflow oven platform with features that maximize thermal performance and productivity while decreasing maintenance and running costs,” said Rob DiMatteo, general manager of BTU International. “The Aurora was designed based on our many decades of experience in reflow with an eye to the future.”
Aurora systems feature a modern, fully updated user interface, integrated Aqua Scrub™ flux management technology, innovative Smart Power energy savings software, and advanced process control technologies. Aurora’s combination of superior thermal performance, process flexibility, and vision for the future sets the new standard for reflow ovens today – and for tomorrow.
This new reflow oven platform features the industry’s first factory configurable heating and cooling architecture providing the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling requirements, or increased throughput. In addition, the Aurora reflow platform features BTU’s exclusive closed-loop convection control technology that has been shown to maintain thermal performance even at significantly increased belt speeds, providing greater productivity, efficiency and throughput.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Altus Group Introduces the ASSCON VP 2200 for High-Performance PCB Assembly
09/10/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, is now offering the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region.
Pick and Place Machine Innovator - NECTEC Launches Next-Gen SMT Line Solution With LED and X-ray Technology
08/26/2025 | Globe NewswireNECTEC PTE. LTD., a leading provider of SMT electronics manufacturing equipment, announced the official launch of its next-generation SMT solutions, featuring newly upgraded pick and place machine, specialized LED pick and place machines, enhanced Reflow Oven technology, advanced X-ray Inspection, high-speed X-ray Counter, and premium Solder Paste
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.