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Indium Corporation Introduces New Low-Voiding Pb-Free Solder Paste
May 9, 2023 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the industry-leading Indium8.9HF chemistry. It features exceptional low-voiding performance while providing excellent stencil print transfer efficiency and response-to-pause performance.
Indium8.9HFRV is a new air reflow, no-clean solder formulated to improve the voiding performance of next generation Pb-free high reliability alloys. Applications requiring extended thermal cycling performance may use Pb-free SnAgCu-based alloys containing Sb, Bi, and In. Indium8.9HFRV is a superior choice for high-reliability alloys, providing both voiding performance and excellent electrical and process reliability. The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
Among its key features, Indium8.9HFRV offers:
- Low voiding when used with high-reliability alloys
- High transfer efficiency through small apertures (?0.66AR)
- Excellent wetting
- Superior response-to-pause performance
- Compatibility with both Air and N2 reflow environments
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Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.