Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
IPC Publishes Sustainability White Paper on Electronic Design and Manufacturing
June 30, 2023 | IPCEstimated reading time: 1 minute
In light of the growing need to understand and address environmental sustainability challenges in the electronics manufacturing industry, the IPC Chief Technologist Council this week published a white paper that serves as an educational primer and a guide to further action for electronics manufacturing companies.
“Electronic Design and Manufacturing Sustainability” provides an overview of eight sustainability topics that affect the electronics industry: product life-cycle assessment; recycling and recyclability; bio-based polymers; modularity, repairability, and reuse; eco-design; data needs and management; energy use; and carbon footprints.
The report also covers several changes needed to help industry move in a more sustainable direction; barriers and pitfalls on the road to sustainability; recommendations for company actions, both near-term and long-term; and more than 30 useful online references.
“We’re hearing from our members and from industry influencers that sustainability is a matter of growing importance in our industry,” said IPC Lead Sustainability Strategist Dr. Kelly Scanlon. “Sustainability reporting requirements are already in place in many countries, and many more are being considered.
“Thus, the purpose of this white paper is to help our members begin to understand and cope with some of the pressing environmental sustainability issues affecting our industry,” Scanlon added.
The white paper is a joint product of nearly 20 industry experts from the IPC Chief Technologist Council, composed of technology leaders from OEM, EMS, component packaging, materials, and PCB companies.
Download the paper and visit the IPC Sustainability for Electronics or the IPC Chief Technologist Council landing pages, for more information.
Share on:
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.