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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Mark Thompson's Biggest Problems With PCB Designs
July 6, 2023 | Mark Thompson, Out of the Box ManufacturingEstimated reading time: 1 minute
What are the top problems I see with PCB design? From where I sit now on the assembly side, one of my biggest concerns related to PCB design is the lack of uniform part markings on the Gerber or ODB++ data, specifically the way customers reference diodes. We would prefer either an “A” depicting the anode side or a “C” or “K” for the cathode side. Many customers simply use either a line or a dot, which requires us to contact them to clarify which side is the cathode and which side is the anode.
If a line is used to denote the cathode side, many times the silkscreen clip using the mask clearance by the fabricator wipes out most of the line, making it difficult or impossible to determine the location of the cathode side. Using a dot doesn’t really help; does a dot depict an anode or cathode? Besides, dots are typically used to denote Pin 1 designators. Please use an “A” for the anode side and a “C” or “K” for the cathode side.
Controlling Controlled Impedances
Another area that concerns me is controlled impedances. Don’t make assumptions about controlled impedances. Your goal as a PCB designer is to simulate impedance to within 10% of your goal. The fabricator should be able to take it the rest of the way since the fabricator knows its press parameters, press values, and effective Dk. Trust your chosen fabricator and use the numbers they provide you.
If you simply go online and check material PDFs for the purpose of establishing impedances yourself be aware that many of the generic spec sheets are for very thick dielectrics (.014" core and sometimes even .028" core) the Dk associated with the thicker dielectrics are higher which, if used for trace widths .005" and below will create a mismatch and the fabricator will come back with a line size that your space may not support.
Also, consider the speed. If the literature is showing 4.5 Dk at 1 Mhz, and you know this product will be running at higher speeds, such as 5,10 or even 20 Ghz, understand the Dk will be driven way down. You may be looking at something closer to 3.8 Dk at 5 Ghz and the mismatch will affect the impedance.
Mark Thompson is an engineering manager with Out of the Box Manufacturing and a longtime CAM expert.
This article appeared in the June 2023 issue of Design007 Magazine.
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SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
PCBAA Sets Its Priorities for 2026: Support in the House and Senate
02/03/2026 | Marcy LaRont, I-Connect007David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In the continuation of this interview, David talks about the ways his organization is aligning its priorities with Washington, in particular, the Executive Branch. It might feel like a snail’s pace, but progress could mean financial support and more domestic security, even for the smaller companies.
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
10/07/2025 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsData is one of the six pillars of AI infrastructure. It is critical to the performance of artificial intelligence (AI) models. AI data, essential to both the training and inference of Generative AI models, connotes the datasets used to train, validate, and test AI models. Training data provides models with a frame of reference by establishing a baseline against which models can compare new data using pre-trained models for predictions or generating new content.
U.S. Uses Secret Trackers to Trace AI Chips Diverted to China, Sources Say
08/18/2025 | I-Connect007 Editorial TeamTwo sources told Reuters that U.S. authorities have secretly placed location trackers in some advanced chip shipments they see as at high risk of illegal diversion to China. They said the trackers are intended to locate AI chips that are sent to locations restricted by U.S. export laws, but authorities only examine some shipments.
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.