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Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification
August 21, 2007 |Estimated reading time: 1 minute
The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $19M contract modification to existing work for additional multi-chip module (MCM) assemblies and equipment in support of a high reliability, high performance computing application.
The MCM's result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI). The assembly is then completed with the addition of a heat spreader and pin connector. A complete flip chip packaging line containing a screen printer, placement machines, a reflow oven and automated optical inspection tools was recently purchased to build these additional MCM's.
"This contract modification win is the result of our ability to meet the performance and reliability demands of this program as well as key cost targets," commented Eric Hills, Director of Military and Defense Programs at EI.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnect solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, aerospace and defense, advanced test equipment, medical and power management, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com .