-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Got Questions? Standards Have the Answers
October 19, 2023 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes

The I-Connect007 Editorial Team recently spoke with Gerry Partida, vice president of technology at Summit Interconnect, and co-chair of the IPC-6012 committee. Gerry has been involved with standards development for years, and he believes that adhering to IPC’s standards and specifications has been a big part of Summit’s success.
In this interview, Gerry explains how Summit utilizes standards, manufacturing data, and information to reduce re-spins and scrap while increasing yield and profitability. He also discusses the repercussions that can occur when designers don’t follow IPC standards. As Gerry points out, everything you need to know is in the standards, so why not follow them?
Nolan Johnson: Gerry, we’ve spoken before about Summit’s use of manufacturing data, including microvia modeling. Tell us about how this all works with DFM rules and IPC standards.
Gerry Partida: Yes, we try to use data and information to make good decisions. We’ve been talking over the last couple of years about modeling microvia reliability. But we also use our ERP systems to collect data, and then look at that data for our yields. If there’s a defect, we can track it to see what has caused it. Then if we buy new equipment to solve and bring that defect rate down, we can track it to see whether our investment is going through to work it out. COO Sean Patterson believes that we are a technology company that owns board shops, so we want to use technology and the tools available to manage and do things in an intelligent manner.
Traditionally, the board industry would just do another re-spin and not analyze what is working and what is not, what the yields are, etc. At times I'll get a very challenging design from a customer who didn't follow IPC rules, and we’ll say, “No, this is not to the reliability that you require.” They’ll reply, “We've been getting these boards built for years,” and I’m thinking, “I understand what you're saying. You've been receiving good boards, but you do not know what is happening to make the quantity of your good boards.” Their fabricator may have had to throw away 50% or 75% of the boards that they produced to get that 100% deliverable.
To read this entire conversation, which appeared in the October 2023 issue of Design007 Magazine, click here.
Suggested Items
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.
The Shaughnessy Report: Breaking Down the Language Barrier
03/11/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportAccording to Ethnologue’s 2024 update, there are currently 7,164 living languages being spoken today. It makes you wonder: Do they count PCB design as a language? PCB fabrication? Assembly?
It’s Only Common Sense: Be the Solution, Not the Problem
03/10/2025 | Dan Beaulieu -- Column: It's Only Common SenseIn life and business, you’re either contributing to the problem or the solution. Customers come to you because they have a challenge, a pain point, or a problem that needs solving. The businesses that customers rave about consistently prove themselves to be problem solvers. Adopting a problem-solving mindset isn’t just good for your customers; it’s the key to building loyalty, standing out in the marketplace, and growing your business.
Finding and Training the Next Design Engineers
03/06/2025 | Andy Shaughnessy, Design007 MagazineThere are a lot of job openings for PCB design engineers, and not enough young people in the pipeline to fill these jobs. How are we going to attract this next generation of design engineers to this industry, and what’s the best course of action for continuous training of these EEs? I asked Bill Hargin, founder and “director of everything” at Z-zero, to share his thoughts continuous training and what the future may hold for design engineers of the future.