Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

HANZA Completes Share Repurchase Program

08/04/2026 | HANZA
HANZA AB repurchased a total of 150,000 own shares during the period July 28 to 31, 2026 under the repurchase program announced on July 27,2026.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/31/2026 | Michelle Te, I-Connect007
When I first came to the electronics industry, I was coming from the outside. Over time, I learned that this is not an industry that can be understood from just one angle. What happens in design affects manufacturing. Material choices affect reliability. Supply chain decisions influence business strategy, and advances in technology create new challenges and opportunities throughout the entire ecosystem. That complexity is one of the things I appreciate most about covering this industry. Each week, I’m reminded that there is always another layer to explore.

Punching Out: M&A Deals in North American PCB and EMS Sectors for the First Half of 2026

07/30/2026 | Tom Kastner -- Column: Punching Out!
Mergers and acquisitions deals in the EMS and PCB sectors in North America in the first half of 2026 were pretty slow for a while, and then, boom, a bunch of deals were announced in May and June, and even more in July. In fact, I hadn’t heard of one deal in the PCB space until June. It is not difficult to understand why deals were moving slowly so far in 2026. The conflict in Iran, higher oil prices, and economic uncertainty contributed to the lack of deal flow.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/17/2026 | Nolan Johnson, SMT007 Magazine
The Pentagon’s announcement on Tuesday that CMMC certification is being immediately suspended is the big news of the week. We’ve been covering the CMMC journey since the beginning, and we’ll stick with the story for the duration. If you’ve followed my list of must-reads, you know that I’m always interested in semiconductor news, and this week had a few good ones. I’ll mention them here, and urge you to read the entire stories: Apple adds to the recent Intel fab agreement by adding to its U.S.-based design and manufacturing agreement with Broadcom; Micron is investing $3 billion to the U.S. semiconductor ecosystem; and Intel announces a 5 billion euro investment in European infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in