Qualcomm Propels Global Expansion of 5G RedCap with Snapdragon X35 5G Modem-RF System
November 8, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
As the world’s first announced commercial release 17 5G RedCap modem-RF system, the Snapdragon® X35 5G Modem-RF System continues to fuel the expansion of the 5G ecosystem by enabling global mobile network operators and OEMs to enable new devices, form factors, and experiences.
With strong customer interest in the industry-leading Snapdragon X35 5G Modem-RF System for 5G RedCap devices, Qualcomm Technologies, Inc. is extending its wireless leadership – spanning modem, RF transceiver, RF front-end and antenna modules – into a fast-growing opportunity for 5G mobile operators. The Snapdragon X35 brings a new class of 5G that bridges the complexity gap between high-speed mobile broadband devices and extremely low-bandwidth internet of things (IoT) devices. RedCap will enable smaller and more cost-efficient 5G devices and provide longer battery life, thanks to their reduced complexity.
Numerous mobile industry leaders around the world have taken notice and are working with Qualcomm Technologies, Inc. to develop and deploy devices powered by Snapdragon X35.
“5G RedCap is one of the primary pillars of 5G Advanced and is key to the evolution of 5G. It bridges the capability and complexity gap between the extremes in 5G today, and can enable a broader set of devices and services as well as enhance system performance and efficiency,” said Gautam Sheoran, vice president and general manager, wireless and broadband communications, Qualcomm Technologies, Inc. “We’re pleased to deepen our collaboration with global mobile operators and OEMs to advance the 5G ecosystem, enabling a new and wide range of premium- and entry-level use cases.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
04/16/2026 | Anaya Vardya, American Standard CircuitsIn the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
Huawei, LG Electronics and Nokia Named as Founder Licensors of New Sisvel POS Pool
04/01/2026 | BUSINESS WIREThree world-class innovators are the founder licensors of the new Point of Sale (POS) patent pool, covering 2G to 5G technology, which Sisvel has launched today.
Asia/Pacific PC Market Up 11.6% in 2025; Supply and Pricing Challenges Loom for 2026
03/24/2026 | IDCThe Asia/Pacific (including Japan and China) traditional PC market (desktops, notebooks, and workstations) grew by 11.6% in 2025 to 106.6 million units, according to the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Devices Tracker, Q4 2025.
Thick Film Materials Market 2026: Driving Electronics Innovation
03/19/2026 | EINPresswire.comThick Film Materials market to surpass $26 billion in 2030. In comparison, the Integrated Circuits market, which is considered as its parent market, is expected to be approximately $658 billion by 2030, with Thick Film Materials to represent around 4% of the parent market.
Texas Instruments Expands Microcontroller Portfolio to Enable Edge AI in Every Device
03/13/2026 | Texas InstrumentsTexas Instruments (TI) introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate