Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

SMTA Renames Event as Microelectronics Packaging & Integration Symposium

10/20/2026 | SMTA
TA is pleased to announce a new name and expanded technical scope for the former Wafer-Level Packaging Symposium.

Kimball Electronics Thailand Joins 2026 Ubuntu Fun Run for Conservation

10/20/2026 | Kimball Electronics
On October 18, 2026, 140 employees from Kimball Electronics Thailand joined the Ubuntu Fun Run 2026 charity walk-run event at Khao Kheow Open Zoo.

KAGA Electronics Signs Contract Manufacturing Agreement with Star seeds for AI Servers

10/13/2026 | KAGA ELECTRONICS
KAGA ELECTRONICS CO., LTD. hereby announces that it has entered into a basic agreement with Star seeds Co., Ltd., an AI infrastructure provider offering end-to-end solutions entirely within Japan, from GPU procurement to AI data center construction and operation.

UVJC to Launch NovaJet at WESEMiBAY as Semiconductor Scaling Evolves

09/21/2026 | BUSINESS WIRE
Universal Vapor Jet Corporation (UVJC) is set to unveil NovaJet, the first commercial system built on its proprietary Universal Vapor Jet Printing (UVJP) platform, at the WESEMiBAY Semiconductor Ecosystem Conference and Expo in Shenzhen, China, from 14 to 16 October 2026.

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028

09/18/2026 | TrendForce
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in