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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Rehm Thermal Systems Sets New Standards in Efficient UV LED Drying with RDS UV LED

07/08/2026 | Rehm Thermal Systems
UV LED technology is becoming a key technology for electronics manufacturing when conformal coatings, adhesives or potting compounds need to be cured quickly, reproducibly and energy-efficiently. With the RDS UV LED, Rehm Thermal Systems transfers the advantages of modern LED radiation sources into a compact oven concept suitable for inline production.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 1

07/07/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry supply chain is moving very quickly with the explosion of AI servers, high-performance computing, ADAS, quantum computing, and 5G/6G. Signal integrity is under scrutiny in an entirely new role. With many factors influencing signal integrity, one area that contributes to signal distortion at high frequencies is the PCB’s final finish layer deposits. Frequencies above 40 GHz are susceptible to such distortions, and data transfer rates of 224 GB/s are driving changes in PCBs and IC substrates.

Where Is Direct Imaging Headed?

06/30/2026 | Marcy LaRont, I-Connect007
At the 2026 EIPC Summer Conference in Lithuania, Dennis Pusch, sales and business development manager for direct imaging at Schmoll Maschinen, examined the latest developments in UV light source technologies and the real-world trade-offs manufacturers must consider. If you're evaluating an imaging system upgrade or simply want to understand where the technology is headed, this interview is well worth your time.

Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.

Remtec to Attend IEEE International MTT- Symposium 2026 in Boston

06/05/2026 | Remtec
Remtec, a leading innovator in advanced ceramic substrates and microelectronic assembly solutions, announced that it will be attending the upcoming IEEE International MTT- Symposium 2026, taking place June 7–12, 2026, at the Thomas M. Menino Convention & Exhibition Center (MCEC) in Boston, Massachusetts.
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