Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
WHMA’s Annual Global Leadership Summit Offers Technical Education Workshop on Strategic Practices for Success
November 28, 2023 | IPCEstimated reading time: Less than a minute
Neil Shah, senior technical director at alliantgroup, a tax and business consultancy, will present a technical education workshop, “Strategic Practices for Success: Outpacing Competitors, Optimizing Bids and Nurturing Top Talent,” on February 13, 2024, from 3:00-5:00 pm, at WHMA's Annual Global Leadership Summit in Myrtle Beach, S.C.
Shah will lead an interactive discussion on trends in the industry and provide practical advice on practices that manufacturers can implement immediately. He will detail recent legislative updates to powerful credits and incentives that have helped WHMA members claim millions in federal funds. Shah will explain how these changes apply to wire harness manufacturers and how they can benefit from these lucrative federal programs.
“In today's competitive market, businesses must be strategic in their approach to remaining competitive, lowering bids, and retaining skilled workers,” said David Bergman, WHMA executive director. “We look forward to learning how the alliantgroup, can help company owners in the cable and wire harness industry take full advantage of federal and state tax credits, incentives, and deductions in order to successfully compete both in the U.S. and abroad.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ASC Sunstone Circuits Adds New Options to OneQuote While Maintaining Real-Time Pricing on Core PCB Features
10/16/2025 | ASC Sunstone CircuitsASC Sunstone Circuits, a leading U.S. PCB manufacturer, today announced a significant expansion of its OneQuote online quoting tool, giving design engineers more control over complex PCB configurations — making it easier for the quote team to quickly clarify and verify specifications, reducing delays from manual quote reviews.
HT Global Circuits Adds Two atg Luther & Maelzer Flying Probe Test Systems
10/15/2025 | atg Luther & Maelzer GmbHAtg Luther & Maelzer GmbH, a leading supplier of electrical testing solutions for the PCB industry, and IEC USA, a distributor of consumables, equipment, and services in the North American PCB market, confirm the order for high-speed bare board testing technology.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.