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Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging

12/17/2024 | ACCESSWIRE
Toray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.

ASMPT: Backchannel Production Planning in Electronics Manufacturing with WORKS

12/16/2024 | ASMPT
The WORKS Software Suite from ASMPT raises production planning in electronics manufacturing to a new level. With its seamless integration of ERP systems and continuous data feedback loop, the software optimizes the planning process in real time – from receiving an order to starting its production run.

Enterprise SSD Market Sees Strong 3Q24 Growth, Revenue Soars 28.6% on Surging Demand for High-Capacity Models

12/11/2024 | TrendForce
TrendForce’s latest investigations found that the enterprise SSD market experienced significant growth in 3Q24, driven by robust demand from AI-related applications.

Enterprise SSD Demand Soars While Consumer Orders Lag, Driving 3Q24 NAND Flash Revenue Up 4.8%

11/29/2024 | TrendForce
TrendForce’s latest findings have shown that the NAND Flash industry recorded a 2% QoQ decline in bit shipments in 3Q24, but a 7% rise in ASP boosted overall revenue to US$17.6 billion—making a 4.8% QoQ increase.

IBM Expands its AI Accelerator Offerings; Announces Collaboration with AMD

11/18/2024 | IBM
IBM and AMD have announced a collaboration to deploy AMD Instinct MI300X accelerators as a service on IBM Cloud. This offering, which is expected to be available in the first half of 2025, aims to enhance performance and power efficiency for Gen AI models such as and high-performance computing (HPC) applications for enterprise clients.
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