Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Green Circuits Unveils Innovative Stacked Capacitors Assembly Process
March 21, 2024 | Green CircuitsEstimated reading time: 1 minute
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors. This technological breakthrough showcases Green Circuits’ capability to navigate and excel in complex assembly challenges, reinforcing its position as a leader in the field.
Faced with a formidable task by one of its top clients, Green Circuits was presented with an automated test equipment (ATE) test board featuring more than 5,000 component placements on a circuit board with a thickness of 0.300". The complexity of the assembly was significantly heightened by the requirement to double-stack 840 capacitors, a challenge not previously encountered by Green Circuits.
Initial considerations suggested hand soldering as a solution, albeit one that would demand in excess of 12 hours to complete a single board. Undeterred, Green Circuits’ team of process engineers dedicated weeks to the exploration of various methodologies and tooling options in pursuit of an optimal outcome. Their perseverance culminated in the development of a robust and repeatable process for the double-stacking of capacitors, marking a significant milestone in process engineering within the industry.
This assembly feat was accomplished on a board characterized by:
- 70 Layers: Using the cutting-edge “B2B” technology, which combines two fabrication layers (FABs) into one, adding to the complexity and technological sophistication of the project.
- 0.300 mil Thickness (7.7 mm): Demonstrating Green Circuits’ capacity to handle and assemble on unusually thick PCBs.
- Populated Over 5,000 Locations: A testament to the company’s ability to manage highly complex assemblies.
- Cap on Cap - 840 Locations: The double-stacked capacitors that posed the unique challenge successfully overcome by the team.
- Flying Probe Testing: Ensuring the highest quality and functionality of the assembled boards.
Green Circuits, Inc. provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. The company is the 2023 CIRCUITS ASSEMBLY EMS Company of the Year and Global SMT & Packaging 2023 Global Technology Award winner for Contract Manufacturers $50-100 million.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
HT Global Circuits Adds Two atg Luther & Maelzer Flying Probe Test Systems
10/15/2025 | atg Luther & Maelzer GmbHAtg Luther & Maelzer GmbH, a leading supplier of electrical testing solutions for the PCB industry, and IEC USA, a distributor of consumables, equipment, and services in the North American PCB market, confirm the order for high-speed bare board testing technology.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Green Circuits Boosts Midwest Presence with New Regional Sales Manager Ray Ponder
10/08/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced the appointment of Ray Ponder as Regional Sales Manager for the Midwest region.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.