Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
New Book on Low-temperature Soldering Now Available
April 17, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download. The latest in a series of educational books published by I-Connect007, this book follows up the first volume, published in 2018 and downloaded by thousands.
Peer Reviewer Kevin Byrd, Intel Corporation, offered his recommendation of the book, stating, “This book provides an excellent overview of both the history of low-temperature solders as well as the recent progress in this exciting surface mount technology. This information will prove valuable for those actively pursuing low-temperature solder conversion of their manufacturing processes as well as those working to understand the progress and future for low-temperature solder materials.”
Download your free copy today at I-Connect007.com/lts2.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Volume 2.
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