-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Breaking High-speed Material Constraints: Design007 Magazine — May 2024
May 14, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

The world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates and the high-speed laminates developed especially for high-speed PCBs.
But then traditional laminates started getting better, and high-speed designers and design engineers took notice. The resin systems have improved to the point that designers are now using flavors of FR-4 for some high-speed PCBs, saving time and money, while streamlining the fab process. In this issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards. Don’t miss it.
Suggested Items
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
05/27/2025 | Polar InstrumentsPolar's latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025. More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed.
Northrop Grumman Navigation Technology Completes Hypersonic Test Flights
05/14/2025 | Northrop GrummanNorthrop Grumman Corporation successfully completed two test flights of its Advanced Hypersonic Technology Inertial Measurement Unit at hypersonic speed, leveraging Stratolaunch’s reusable hypersonic airplane, Talon-A.
Wolfspeed Announces Executive Leadership Change
05/02/2025 | WolfspeedWolfspeed, Inc. announced that it has mutually agreed with Neill Reynolds to conclude his role as Executive Vice President and Chief Financial Officer, effective May 30, 2025, to pursue another professional opportunity.
Bell Boeing Celebrate U.S. Air Force CV-22 Program of Record
04/29/2025 | BoeingBell Textron Inc., a Textron Inc. company, and Boeing celebrate the upcoming completion of the CV-22 Program of Record (POR) for the U.S. Air Force. Bell and Boeing commemorated the V-22 Osprey production milestone during a ceremony at the Bell Amarillo Assembly Center on April 18.