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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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IPC White Paper Emphasizes the Critical Importance of ‘Design for Excellence’ Throughout the Full Ecosystem of Electronics Design
June 27, 2024 | IPCEstimated reading time: 1 minute
A new white paper from IPC’s Chief Technologist (CTC) and Design Leadership (DLC) Councils, Better Electronics by Design: Next Generation Design Needs explores the elements of the “Design for Excellence” methodology, re-thinking how it needs to be further defined and applied in the full ecosystem of electronics design.
In addition, the whitepaper provides a high-level exploration of the full “silicon-to-systems” ecosystem, examines the justification and implications of an Authoritative Source of Truth (ASOT), discusses the need for synergy between building blocks of electronic systems, and takes a deep dive into the subject of design rules and “design for manufacturability.”
Key messages within the white paper include:
- Electronic systems are increasingly complex and heterogeneous.
- Facilitation of an Authoritative Source of Truth (ASOT) is mandatory to ensure consistency, efficiency, and traceability.
- The industry needs a more robust and interoperable toolset to support greater silicon-to-systems collaboration.
- Diverse electronic and mechanical CAD systems must gain interoperability by including proper model-based definitions (MBD) and collaborative software to cover both disciplines.
- A shift towards true digital collaboration and automation and an early consideration of manufacturing capabilities across the development process is essential to master increasing time-to-market and complexity challenges.
“Creating better electronics by design is a common, collective goal of the electronics industry,” said Peter Tranitz, IPC senior director, technology solutions, and leader of IPC’s design initiative “To achieve this, an ASOT should be established and protocols,
standardized. To leverage the associated benefits, a culture of real digital collaboration, transparency, and accountability needs to be established. Tools need to support bi-directional, incremental exchange of information. And, design rules need to be broken down to the relevant stages of the design workflow and checks need to be performed after every stage of the design process to drive the concept of ‘shift left.’ For effective Design for Manufacturability execution, manufacturers need to provide clear guidance on manufacturing capabilities and constraints to designers.”
Download the report: https://go.ipc.org/next-gen-design.
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.