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IPC/iNEMI Webinar on Circularity Challenges in Electronics Manufacturing
July 2, 2024 | iNEMIEstimated reading time: 1 minute
IPC and iNEMI held a workshop with industry experts at the Electronics Goes Green conference in Berlin last month to discuss circularity challenges in electronics manufacturing. The workshop — "There’s no end to a circle: A workshop on how to address circularity challenges in electronics manufacturing" focused on scoping industry solutions to address pressing circularity challenges.
Join us for this webinar to learn more about workshop results and discuss next steps that will lead to work by iNEMI and IPC to assist industry with: Scope of Work statements for new industry standards, tools, and education Ideas for solutions to address the identified problems.
Next steps and additional workshop opportunities. Solutions driven by industry collaboration will help enable efficient and effective adoption of circularity through the electronics manufacturing value chain.
Presenters
Kelly Scanlon, IPC
Lead Sustainability Strategist
Mark Schaffer, iNEMI
Project Manager
Registration
This webinar is for people who attended the EGG workshop as well as those who could not attend but would like to join the conversation. We will be continuing — and building on — the discussion about solutions needed to enable circular economy principles in the electronics industry. The webinar is open to industry; advance registration is required (see link below). If you have any questions or need additional information please contact Mark Schaffer (marks@inemi.org)..
Wednesday, July 17, 2024
10:00-11:00 a.m. EDT (Americas)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Testimonial
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Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.