Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Innovative and Cost-effective BGA Re-balling
July 23, 2024 | Shavi Spinzi, Nano Dimension/EssemtecEstimated reading time: Less than a minute
A new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
In this article, we explore the challenges, solutions, and impact on assembly with large BGA devices and propose a new technique appropriate for many electronics segments, including military, aerospace, computing, and communication.
The Need for BGA Re-balling
There are several reasons for BGA re-balling, including economic, technological, reliability, sustainability, and specific industry requirements.
To read this entire article, which appeared in the July 2024 issue of SMT007 Magazine, click here.
Share on:
Suggested Items
LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory
05/01/2025 | PR NewswireLG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
ASMPT Demonstrates Technology Leadership in SMT Assembly
04/09/2025 | ASMPTThe rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
TopLine Bringing Answers, New Ideas to APEX 2025
02/04/2025 | TopLineTopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.