-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Strip Etch Strip: Episode 9 of On the Line With... Designing for Reality Podcast Now Available
July 25, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss the latest episode of "On the Line With... Designing for Reality," where we walk through the PCB manufacturing process. At this stage, we have a panel made up of all the internal layers laminated together, through-holes drilled, and the outer layer copper features covered with a protective layer of tin. Join us as ASC Sunstone’s VP Matt Stevenson guides us through the process sequence for outer layer strip, etch, and strip.
This series offers specific insights that can impact circuit board manufacturing, providing tips and tricks for optimizing design, fabrication, yields, and cost.
I-Connect007 is committed to delivering digital content that meets the needs of the electronics industry, including magazines, books, newsletters, market reports, podcasts, and event coverage. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of original content for the global electronics industry.
Visit our educational resource center to access more free content.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
03/31/2026 | Happy Holden -- Column: Happy’s Tech TalkMultilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
SCHMID Group Wins Major Order for Wet-Process Equipment for AI & HPC Infrastructure
03/11/2026 | SCHMID GroupSCHMID Group, a leading global supplier of advanced wet process equipment for the electronics manufacturing industry, has secured a lower two-digit million-USD purchase order from a major Asian high-end PCB manufacturer for a new HDI multilayer production line.
Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
02/18/2026 | Anaya Vardya -- Column: Standard of ExcellenceThe future of PCB manufacturing is here. The products we’re being asked to build today would have been called “advanced” just a few years ago. What was once special is now standard, and what was once impossible is now expected. The challenge and the opportunity lie in leading the charge to the next frontier of printed circuit board design, materials, and manufacturing discipline. To build the board of the future, we need new materials, smarter methods, and a mindset of innovation anchored in flawless execution.
UHDI Fundamentals: An Overview of UHDI Layer Types
01/02/2026 | Anaya Vardya, American Standard CircuitsUHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.