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ULT Introduce New Extraction Solution for Combustible and Carcinogenic Laser Dusts
August 6, 2024 | ULT AGEstimated reading time: 1 minute

ULT is introducing the LAS 260 H/Ex, a new solution for removing critical dust during various laser processes. The explosion-proof device was developed for extracting and filtering dry, combustible, and health-endangering pollutants (dust and fumes) that can arise during laser processing of plastics and metals.
As an ATEX-compliant system designed to be free of ignition sources, the LAS 260 H/Ex is suitable for installation and operation within a zone 22 and enables the safe separation of combustible dust. Even the finest particles are separated to 99.995% in a two-stage filter system including a HEPA H-14 filter and safety filter stage.
The safety filter with integrated activated carbon filling ensures the safe operation of the device and removes gases that are hazardous to health and unpleasant odors. Due to the high level of cleaning, the filtered clean gas can be fed back into the work area even when carcinogenic, mutagenic, or toxic dust is separated (recirculation mode).
In addition to the redundant filter system, the LAS 260 H/Ex provides further user benefits such as high flexibility through mobile utilization, extremely quiet operation, and low energy consumption.
All electrical components are suitable for UL and CE compliant use. In addition, the device can be used worldwide with a voltage range of 110-240 V.
To ensure compliance with the minimum volume flow of >20 m/s, an automatic monitoring system is integrated, which issues a warning signal if the flow falls below this limit.
A collection element (hose, pipe, extraction arm) with DN50 can be connected to the extraction and filter system. In addition, an M12 i
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Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
07/23/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
DuPont Publishes 2025 Sustainability Report
07/22/2025 | PRNewswireDuPont published its 2025 Sustainability Report detailing the progress made toward achieving its 2030 Sustainability Goals.