-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Are You Ensuring PCB Durability? Dive into Solder Mask and Legend on 'On the Line With…’ Podcast
August 12, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss the latest episode of "On the Line With… ASC Sunstone: Designing for Reality," featuring ASC Sunstone’s Matt Stevenson as we delve deeper into the PCB manufacturing process. With a functioning PCB in hand, there’s still essential work to protect it from environmental effects and document the circuit components. This episode focuses on the crucial steps of applying solder mask and silkscreen.
This series is a trove of valuable insights for anyone involved in circuit boards manufacturing with expert tips and tricks for optimizing design, improving fabrication, boosting yields, and cutting costs.
I-Connect007 delivers top-tier digital content tailored to the electronics industry, from magazines and books to newsletters, market reports, podcasts, and event coverage. As the industry’s longest-running digital media company, we are the leading source of original content for the global electronics community.
Visit our educational resource center to access more free content and elevate your expertise.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
KLA Reports Fiscal 2026 Q3 Results
04/30/2026 | PRNewswireKLA Corporation announced financial and operating results for its third quarter of fiscal year 2026, which ended on March 31, 2026, and reported GAAP net income of $1.20 billion and GAAP net income per diluted share of $9.12 on revenues of $3.415 billion.
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
TPCA and Industry Leaders Convene in Bangkok for Thailand PCB Summit
04/30/2026 | TPCAAt a critical juncture of global supply chain restructuring and the explosive growth in demand for AI computing power, Thailand is becoming a crucial hub for the next wave of high-end manufacturing in the electronics and circuit industry.
Jiva Soluboard Getting the Attention It Deserves
04/30/2026 | Marcy LaRont, I-Connect007 MagazineJiva is a newer company that bridges the divide between PCB fabrication and product circularity or sustainability. Jiva Soluboard is the first fully recyclable laminate material ever created for PCB fabrication, and it's not going unnoticed. Stephen Driver, CEO of Jiva, gave us an update at APEX EXPO, including an exciting certification achievement in February.
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.