-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Keys to Successful ECAD-MCAD Collaboration
August 8, 2024 | Stephen V. Chavez, Siemens EDAEstimated reading time: Less than a minute
As PCB designs grow in scope and complexity, collaboration between the electronics and mechanical domains is a necessity. At the same time, smaller IC packages and more tightly packed PCBs compel electronics system development companies to think more about the mechanical form factor of items and recognize the importance of collaboration between MCAD and ECAD.
For example, as PCB designs face tighter requirements, problems resulting from electromechanical interference are becoming more common. Handling these kinds of problems across disciplines requires real-time collaboration—facilitated by automated tools and flows—and synchronized data.
An integrated ECAD/MCAD collaboration environment enables electrical and mechanical design teams to work together throughout the entire design process in real time, sharing cross-domain information incrementally and as changes occur. In this way, ECAD and MCAD collaboration allows teams to stayed synced and spot and correct errors or issues as they occur.
To read the entire article, which originally appeared in the July 2024 Design007 Magazine, click here.
Suggested Items
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.
UK, Cyprus Strengthen Space Ties
04/14/2025 | ESAThe first Cyprus-UK Bilateral Cooperation Event brought together representatives from the space sectors and governments of both countries, with the support of the European Space Agency (ESA).
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
L3Harris, Kuiper Government Solutions Partner on Resilient Satellite Communications Solutions
04/08/2025 | L3Harris TechnologiesL3Harris Technologies and Kuiper Government Solutions LLC (KGS), a subsidiary of Amazon.com, Inc., have partnered to deliver integrated, resilient Satellite Communications (SATCOM) solutions to governments and militaries worldwide.