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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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A French Design Community
August 21, 2024 | Michelle Te, IPC CommunityEstimated reading time: 1 minute
The French IPC Designers Council is a unique conglomerate of 250 members from all parts of the industry: EEs, designers, CAD engineers, PCB manufacturers, EMS suppliers, OEMs, and even some in component packaging, that encourages individuals to freely exchange their design issues without commercial considerations.
Thomas Romont, a PCB manufacturer’s rep with more than 20 years of experience, especially in the design for manufacturing (DFM) process, leads this association with support from IPC. “Design is particularly complex because it involves all electronics disciplines, from the electronics technician to the user, including manufacturing and testing. It is not easy to bring all these people together around the same table and get them to discuss and understand each other,” he says.
In his conversations with fellow PCB designers Mike Creeden and Gary Ferrari about seven years ago, they discussed existing design chapters in North America and the social networking and support those chapters offered.
“Noting that there were no such councils in Europe, or in France where I live, I asked Pierre-Jean Albrieux, CEO of IFTEC, if he was ready to support me in creating a French chapter,” Thomas says. With IFTEC’s support, Thomas organized a design conference that dealt with the difficulties of the design profession and the solutions that IPC could provide.
During the conference, he outlined his intention to create a French-speaking IPC designers council. “This initiative was extremely well received by the assembly and some people even offered to create a board to steer the creation of this new association,” Thomas says.
Read the rest of this article in the Summer 2024 issue of IPC Community.
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A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.