Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

10/08/2024 | TSMC
Amkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.

Amentum Secures $256M Contract to Propel NASA’s Space Exploration Projects

10/07/2024 | BUSINESS WIRE
Amentum was awarded the Fully Integrated Lifecycle Mission Support Services II (FILMSS II) contract by NASA with a maximum value of $256 million to spearhead cutting-edge technologies and manage groundbreaking science projects in support of NASA’s exploration and aeronautics objectives at the Ames Research Center.

TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation

10/04/2024 | TAIFLEX Scientific Co. Ltd
Tazmo Co., Ltd. and TAIFLEX Co., Ltd.  held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei.

MIRTEC Celebrates 20 Year Milestone Anniversary

10/04/2024 | MIRTEC
MIRTEC Co., LTD, “The Global Leader in Inspection Technology,” proudly celebrates the 20th anniversary of its North American Sales and Service Division, MIRTEC Corp.

RTX to Develop Ultra-wide Bandgap Semiconductors for DARPA

10/03/2024 | RTX
Raytheon, an RTX business, has been awarded a three-year, two-phase contract from DARPA to develop foundational ultra-wide bandgap semiconductors, or UWBGS, based on diamond and aluminum nitride technology that revolutionize semiconductor electronics with increased power delivery and thermal management in sensors and other electronic applications.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in