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ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
October 8, 2024 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
The SMTA International Conference & Expo provides an excellent opportunity for ViTrox to connect with suppliers, buyers, and users within the electronics manufacturing and assembly industry. This year, ViTrox proudly presents V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution and award-winning V9i Advanced Robotic Vision (ARV) Solution, setting a new standard in flexible inspections for conformal coating and final assembly.
Discover ViTrox's State-of-the-Art Inspection Solutions:
V310i Advanced 3D Solder Paste Inspection (SPI) Solution
This solution is engineered to deliver unmatched precision in solder paste inspection and is suitable for operators of all levels. Its Ultra Smart Programming feature allows users to easily set parameters, reducing human dependency and enabling faster programming for increased productivity. It complies with IPC-CFX-2591 standards, ensuring optimal results and setting a new industry standard for solder paste inspection.
V510i Advanced 3D Optical Inspection (AOI) Solution
ViTrox’s V510i 3D AOI Solution integrates advanced Artificial Intelligence (A.I.) Smart Technologies, automates programming and buy-off processes. This reduces reliance on skilled manual labour and minimises human error. With A.I. Smart Programming, users can achieve up to a 4x reduction in programming time, enhancing yield. The A.I. Assisted Defect Review (A.I. VVTS) feature further automates defect verification in repair stations, delivering over 90% judgement accuracy. This leads to approximately a 60% reduction in labour costs. Additionally, the solution meets IPC-CFX-2591 standards, earning its place on the Qualified Products Listing (QPL) and ensuring seamless integration with Industry 4.0 smart manufacturing environments. The V510i 3D has been widely recognised for its outstanding performance, receiving multiple esteemed awards such as the 2024 New Product Introduction Award, 2023 Global Technology Award and 2023 Mexico Technology Award.
V9i Advanced Robotic Vision (ARV) Solution
The V9i ARV features a 6-axis COBOT design, allowing adjustable angle inspections up to 90°. Its Advanced Smart Learning Algorithm detects various conformal coating defects and performs final assembly inspections of screws, cosmetics, connectors and labels without requiring CAD data. With multifocal vision ranging from 5mm to 200mm and image clarity up to 14µm/px, it ensures accurate defect detection. Seamlessly integrating into production lines via SMEMA or operating offline, the V9i ARV enhances traceability and provides reliable, comprehensive inspection coverage. The V9i ARV has earned prestigious industry awards, including the 2024 New Product Introduction Award, 2021 Global Technology Award and 2020 IPC APEX EXPO Innovation Award, recognising its outstanding performance and innovation.
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NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.