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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 8, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute

In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.
Real Time with... SMTAI 2024: John Johnson on American Standard Circuits' Advanced Technology
Published November 6
In this interview from SMTAI 2024, American Standard Circuits' John Johnson details a conversation that starts with the news of a new LED imager and pivots to a peek into American Standard's capabilities roadmap for the next three years. Click to listen now.
Biden-Harris Administration to Invest $825 Million in First CHIPS for America R&D Facility
Published November 1
The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility—within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.
Solid-State Batteries Enter Pilot Production, Costs Expected to Drop to CNY 0.6–0.7/Wh by 2035
Published November 1
Battery technology not only continues to develop but is accelerating, according to TrendForce. Learn more about how SSBs will change in the next 10 years.
Real Time with... SMTAI 2024: SPEA Brings Added Sophistication to Board Testing Capabilities
Published November 5
Nolan Johnson spoke with Luca Fanelli from SPEA at SMTAI 2024. In this interview, Fanelli describes SPEA's new AI-based optical inspection technology and shares a powerful example from the field. He also updates Nolan Johnson on SPEA's organizational growth meant to improve customer value. Click here to listen.
Root-cause Analysis and Problem-solving
Published November 1
Happy Holden’s article in October’s PCB007 Magazine pulls from more detailed information in his book, 24 Essential Skills for Engineers, the books section). If your job involves problem solving and root cause analysis, it’s a useful read. And check out the book, too.
Suggested Items
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
DuPont Achieves 100% Renewable Electricity Across its European Union Operations
05/28/2025 | DuPontDuPont announced 100 percent of its grid electricity is from renewable sources across its entire European Union (EU) operations, through the use of Renewable Energy Certificates (RECs).
NVIDIA Expected to Launch RTX PRO 6000 Special Edition for China’s AI Market, Potentially Boosting Future GDDR7 Demand
05/28/2025 | TrendForceTrendForce reports that following the new U.S. export restrictions announced in April—which require additional permits for the export of NVIDIA’s H20 or any chips with equivalent memory bandwidth or interconnect performance to China—NVIDIA is expected to release a special low-power, downscaled version of the RTX PRO 6000 (formerly B40) for the Chinese market.
CIMS to Exhibit at JPCA Show 2025
05/28/2025 | CIMSCIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.