-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
December 23, 2024 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute

Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing:
Smart Manufacturing and IoT-Driven Automation
UHDI enables the miniaturization and performance enhancement of IoT sensors, which are the backbone of Smart manufacturing. With this level of automation, UHDI aids in integrating advanced security measures within IoT devices to prevent data breaches.
- Compact IoT sensors and modules: For real-time data acquisition and machine monitoring
- High-density connectivity: For edge computing devices that process data locally in smart systems
- Energy-efficient controllers: For powering distributed sensor networks
- Multi-sensor integration: UHDI allows multiple sensors (e.g., temperature, pressure, vibration) to be packed into a single compact unit
- Real-time data processing: Dense circuitry ensures high-speed data acquisition and transmission
- Durability: Reliable connections for sensors operating in harsh factory environments
- Hardware-based encryption modules: Ensuring secure data transmission
- Compact circuits for secure booting: Protecting devices from unauthorized access
To read this entire article, which appeared in the December 2024 issue of Design007 Magazine, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/20/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.