New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!

Estimated reading time: 1 minute

The final episode of the On the Line With…Optimize the Interconnect^SM podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing.

Throughout the series, subject matter experts have explored the drivers behind today’s technology demands, including AI, automotive electronics, and advanced consumer devices, and examined their impact on PCB design and production. Guests tackled critical challenges such as blind microvia (BMV) reliability, shrinking line/space geometries, and higher aspect ratios, highlighting strategies to address them through equipment, chemistry, and process integration.

In this concluding episode, final guest MKS’ Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase. “Technology never stands still,” he noted. “The companies that thrive will be those that adapt quickly, embrace innovation, and work closely with supply chain partners to meet the challenges of next-generation PCB manufacturing.”

Listeners can also download a free companion guide for a deeper technical dive into unified via formation. The guide includes case studies that showcase the measurable performance gains of OTI in action.

• Catch up: Listen to all six episodes here.
• Read the companion guide here.

I-Connect007’s On the Line With… podcast series is available now on the I-Connect007 platform and major podcast directories.