SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
epoxySet Launches UV-8675 – Deep Section, UV Cured Adhesive for PVC
February 19, 2025 | epoxySetEstimated reading time: Less than a minute
epoxySet introduces the UV-8675, acrylated urethane adhesive for bonding PVC, polycarbonate and most other plastics. Designed for bonding PVC tubing in medical devices, it also bonds well to glass and metals. This semirigid polymer offers high bond strength without causing stress cracks. UV-8675 can be cured in thicknesses from 10um and up to 10mm. It can be used in very tight adhesive applications as well as for larger gap filling.
The UV-8675 is low to medium viscosity matrix that can be easily dispensed by hand or pneumatic machine. With a cure of under 10 seconds (365nm, LED or broadband light), it produces a tough, high strength adhesive with an elongation of 210% and is excellent for temperature cycling from -40 to 85°C.
UV-8675 is available in 3, 10 and 30cc syringes as well as 8oz, 1 liter bottles, gallon and pails. UV -8685 is non-hazardous for shipping and has a shelf life of one year at room temperature.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
07/23/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
DuPont Publishes 2025 Sustainability Report
07/22/2025 | PRNewswireDuPont published its 2025 Sustainability Report detailing the progress made toward achieving its 2030 Sustainability Goals.