SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures: The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
May 12, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
Our component salvaging services include BGA’s, QFN’s and LGA’s, BGA re-balling, and reconditioning. All are performed with strict MSD and ESD safeguards. We also offer remarking, bake-out, and packaging in trays, tubes, or tape and reel in accordance with EIA-481 standards. The process involves mechanical disassembly of electronic devices, selective removal of soldered components, reconditioning of leads and pads, laser marking for traceability, and packaging optimized for automated circuit board assembly.
BEST specializes in properly processing and preparing printed circuit boards, ensuring components are safely removed and correctly conditioned for re-insertion into the manufacturing flow. Harvesting components from PCBs helps alleviate shortages of high-value or hard-to-source electronic devices. Our expertise includes reconditioning ball grid arrays, ultra-fine pitch QFPs, QFNs, LGAs, and other electronic packages, providing end-users with confidence in our high-quality reclaiming processes. Our extensive experience in BGA removal, replacement, and reballing makes our salvaging services particularly effective and valuable. With years of industry expertise, we deliver the highest yields while maintaining strict standards of quality and reliability.
In conjunction with our ongoing electronic component reclamation activities, BEST is actively involved with the development of the IPC-7712 Component Reclaim Standard to advance circularity within the electronics manufacturing industry and expand the ability of component reuse as opposed to recycling of electronic waste.
The importance of using high-quality workmanship standards throughout the component reclamation process is essential. This serves to ensure the integrity of the component supply chain, facilitating environmental responsible practices, and reducing reliance on energy intensive fabrication of new electronic components.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
LITEON Technology Reports Consolidated September Sales of NT$15.4 Billion, Up 30% YoY
10/09/2025 | LITEON TechnologyLITEON Technology reported its September consolidated revenue of NT$15.4 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 30% Y-o-Y. The cumulative sales for January to September totaled NT$121.7 billion, up 23%, Y-o-Y.
Nomination Committee Appointed for HANZA AB's 2026 Annual General Meeting
10/09/2025 | HANZAAccording to a decision at HANZA AB's most recent Annual General Meeting, a Nomination Committee consisting of four members, including the Chairman of the Board, shall be appointed by the three largest shareholders or shareholder groups in terms of voting rights.
Quilter Secures $25M Series B to Eliminate Manual PCB Design with Physics-Driven AI
10/09/2025 | BUSINESS WIREQuilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.