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TRI Unveils New Platform for Diverse Board Sizes
July 14, 2025 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
The new Size M configuration for selected Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) platforms provides manufacturers with greater flexibility for large-sized board applications, such as EV batteries, data center boards, and more.
The size M configuration has a board handling capability of up to 660 x 690 mm, the lineup includes the TR7007M SIII and TR7007MD/Q SII for SPI, and the TR7700MQ SII, TR7700M SIII Ultra, TR7500M SIII Ultra, and TR7700MQC SII for AOI.
TRI inspection solutions support current Smart Factory and communication standards such as SMEMA, SECS/GEM, IPC-CFX-2591, and IPC-HERMES-9852, ensuring a cost-effective, Industry 4.0-compliant solution for comprehensive defect detection and data exchange.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
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TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
08/08/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.