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IPC Intl Conference on Flexible Circuits February 12-13
January 7, 2008 | IPCEstimated reading time: Less than a minute
Fine lined? Multilayered? Highly dense with IC packages on top? Flex offers an array of choices with a growing number of benefits. For managing high temperatures successfully, reducing weight and space and saving on assembly costs, flex can be the answer you've been searching for. Learn about new manufacturing technologies, high density flex and applications at the IPC International Conference on Flexible Circuits being held February 12-13, 2008, in Phoenix, Arizona, USA.
Visit www.ipc.org/flex for details.