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New Low Dk/Df Materials for High Speed PCBs
June 24, 2008 |Estimated reading time: Less than a minute
With the growth in mobile communication devices, PCB fabricators have been looking for more affordable and easily processable low Dk/Df material. The authors describe a new material that has a Dk of 3.8 at 1 GHz (10% lower than that of conventional FR-4) and Tg that is higher than 170 C. Click here to read the paper written by Duksang Han, Tim (Minsu) Lee and DongKi Nam of Doosan Corp. and presented at Apex this year.