-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Panasonic Meeting Market Needs with Higher-Performance Megtron 7
March 17, 2015 | Pete Starkey, I-Connect007Estimated reading time: 8 minutes

I-Connect Technical Editor Pete Starkey sat down with Panasonic’s Tony Senese and Tomoyuki Abe at IPC APEX EXPO 2015 in San Diego–high-speed digital materials, particularly those with very low-loss characteristics, was the focus of their discussion. Also noted were the positive responses from chemical process suppliers, and the realistic length of a product development cycle.
Pete Starkey: Panasonic Megtron 6 has become established as the industry standard, but I understand there is a new product coming out of development and in the early stages of production, Megtron 7, which is the lowest-loss material that is currently available from Panasonic. Can you gentlemen give me some details of the characteristics and performance of the material, and the sort of applications of the industry sectors where this material is going to be of substantial benefit?
Tony Senese: We have a technology development roadmap that we update on a regular basis at least a couple times a year, and we have several market segments that we track our products in.
Tomoyuki Abe: Right now, Megtron 6 is the standard of the high-end server router equipment material, but the market is requesting the more high-speed material. Megtron 6 is quite good, but the market needs higher-performance material.
Starkey: To clarify, when you talk about high-speed material, what sort of data rates are you aiming at?
Senese: In the high-speed digital area right now, products are operating in the 10 Gbps to 20 Gbps range enabled by Megtron 6. However, at 20 Gbps other things have to be done to the circuit boards to make them meet the loss budget. Megtron 6 enabled the major IT infrastructure suppliers to use very similar design techniques to what they were using at lower speeds—say, 6–10 Gbs. So now, that is kind of the standard rate in that high-speed digital arena.
Starkey: So Megtron 7 effectively is an enabler that opens up the possibilities for them to develop into higher data rates?
Senese: That’s right. Basically, at the 25 Gbps data range, which is actually already in place, Megtron 7 removes a few roadblocks that make the fabrication difficult. At the 25 Gbps data range, especially on the large format back planes, and some of the line cards, the loss budget is too close to the mark, even with Megtron 6. It is a goal of all of these infrastructure companies to increase the amount of data they can transmit because of things like streaming video that have started to become ubiquitous, so they need to have their core routers to be much faster.
So 25 Gbps is where they're designing right now, and there are people who are designing certain pieces of equipment at the 50 Gbps range. So that meansthat really Megtron 6 isn't enough to build those core routers, as is.
There are connectors being developed that are fast enough and can be used that are early in production, and the people that are building what I would call proof-of-concept hardware are really just too close to the edge. They can build it once, but they can't build it in high volume, or even in normal quantities. But when it comes to loss, there is quite the difference from Megtron 6.
Page 1 of 3
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.