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Fast Interconnect Announces Multi-Platform Design Services
September 2, 2015 | Fast InterconnectEstimated reading time: 1 minute
Fast Interconnect is now offering its customers a choice of CAD software platforms. According to co-founder Gary Griffin, “One large benefit of coming to Fast Interconnect is that fact that we can design your product in your existing CAD software package. Many companies that ask for design updates find it hard to find a company to assist them that can use the software they have established as their core software design suite.”
This provides immediate advantages for PCB designers.
“Keeping the design in the software currently being used enables the customer to have a useable database in their archive that their engineers are comfortable with. This also means that for future updates the customer is not forced to remember what package was used and where it was done,” Griffin continued. “This provides a freedom from being forced to go with a different design package simply because you are in a hurry and don’t feel you have a choice. We provide that freedom of choice.”
The available CAD packages are Mentor Graphics PADS/Xpedition®/xDX Designer, Cadence Allegro®, Zuken CADSTAR, Altium, P-CAD and Protel. Schematic capture packages for all of the aforementioned, as well as Cadence OrCAD.
As a value-added service, Fast Interconnect performs a full CAM preview of the Gerber files before they are released to the customer. This ensures there are no issues that were not evident during the design review.
For more information, visit www.fastinterconnect.com.
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09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
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I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).