-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Mentor Debuts Version 8.1 of ODB++ Product Model for PCB Mfg
September 10, 2015 | PRNewswireEstimated reading time: 3 minutes

Mentor Graphics Corporation has announced the newest version of the industry-leading ODB++ intelligent product model, a single and open data structure for transferring printed circuit board (PCB) designs into data for fabrication, assembly and test. The version 8.1 of the ODB++ product model format provides a unique virtual documentation capability that seamlessly translates all data files, drawings, and documents from PCB design through the manufacturing flow.
This open product model format eliminates the need to create and validate disparate documentation content, supporting all electronic design automation (EDA) tool flows. Users of the new ODB++ version will be able to share all the necessary manufacturing instructions as electronic data, making new product introduction (NPI) more efficient for all partners in the supply chain.
The idea behind virtual documentation content is to replace a disparate set of drawings, documents and instructions with data elements that allow the recipient tool to automate the planning and execution of the manufacturing process preparation actions. An example would be to define the solder mask finish color within the ODB++ product model so that a PCB fabricator can automatically generate the process, material and routing instructions for that individual factory.
The ODB++ product model also includes support for EDA-based design net connectivity shorts. In many designs, one or more nets are intentionally shorted into a single net; the ODB++ product model now carries that net attribute so that all downstream processes can be streamlined and automated. The lack of such net characterization has been a limitation of existing data formats, resulting in wasted efforts between design and manufacturing.
Additionally, content for rigid-flex buildup zones to define regions within the basic stack-up (either unique or within the same region) on the board can be carried forward into analysis and in the actual material-based stack-up definition. This feature delivers accurate impedance calculations, using tools such as the Frontline InStack for this capability. By accurately identifying the physical boundary of different stack-up areas for a rigid-flex circuit, the correct DFM rules can be applied automatically, and rigid-flex circuit manufacturers can easily and accurately calculate the impedance values for the circuit using their choice of materials.
Supporting All Intelligent Product Model Formats
Mentor Graphics and the Valor Division have a proven legacy regarding the lean NPI hand-off from design to manufacturing, including stewardship of the ODB++ product model. A new format known as the IPC-2581 standard has emerged for organizing and conveying PCB designs from CAD tools to CAM systems for fabrication and assembly. Mentor is extending its support to the IPC-2581 Consortium and accompanying format standardization efforts.
"Mentor is the market leader for PCB design software and provides a best-in-class solution for NPI. With our latest ODB++ intelligent product model format, we now offer customers a complete and open design-through-manufacturing ecosystem," stated A.J. Incorvaia, vice president and general manager of Mentor Graphics Systems Design Division. "Our mission is to provide our customers with the best tools and technologies to increase overall product quality and productivity. This includes support for ODB++ and IPC-2581, giving our customers a choice in data exchange formats for hand-off to manufacturing."
"I am very pleased that Mentor Graphics has chosen to participate in the IPC-2581 consortium. Both Mentor's successful ODB++ experiences and the successes of the IPC-2581 consortium make a winning combination in our country's efforts to optimize the design-to-manufacturing ecosystem. I look forward to witnessing the progress of this exciting and challenging effort," said Gary Ferrari, technical support director, FTG Circuits.
Most Widely Adopted Data Format Worldwide
With over 18,000 global members and over 60 partners to implement and develop the ODB++ product model format as the de facto standard, it is supported by all computer aided manufacturing (CAM) systems sold over the past ten years. A lean NPI process encompasses DFM-validated (clean) product model transfer between tools in the design-to-manufacturing ecosystem – it's not just about a data format. Around 80% of all boards used in the world are Valor® ODB++ compliant because of alignment within the ecosystem. The ODB++ Solutions Alliance was developed for the PCB manufacturing implementers and supporters, offering free software tools, specifications, documentation, and forums for users.
About Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in excess of $1.24 billion.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.