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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
October 31, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
In this 20-minute discussion, John Johnson explains why solder mask application is one of the most pivotal—and often underestimated—steps influencing UHDI performance and reliability. He shares how fabricators must fine-tune their processes to fully realize UHDI’s potential and achieve lasting success in ultra-fine feature manufacturing.
Listen here now and download the free takeaways from each episode here to keep your UHDI knowledge sharp and actionable.
The episode is also available on all major podcast platforms, including Apple and Spotify.
About the On the Line With… Ultra HDI Series
On the Line With… Ultra HDI is a 12-part podcast series from I-Connect007 exploring the processes, materials, and design considerations driving ultra-high-density interconnect technology.
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Simon Khesin - Schmoll MaschinenSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
CIL Joins EU Project OSYRYS to Bring Hybrid-electric for Regional Flight Closer to Reality
03/24/2026 | CILWhat if the future of regional flight was hybrid-electric—and closer than you think? CIL joins a diverse group of 24 EU industrial, research, and academic partners to make it reality.
DigiKey Collaborates with STMicroelectronics and Ultra Librarian to Deliver Enhanced eDesignSuite Integration
03/20/2026 | PRNewswireDigiKey, the global distribution leader of electronic components and automation products, announces the availability of an enhanced eDesignSuite experience, developed through a collaboration with STMicroelectronics (ST) and Ultra Librarian.
STMicroelectronics Advances Ultra-Wideband for Automotive and Smart Devices
03/13/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an ultra-wideband (UWB) chip family that comprehensively supports the next-generation wireless standard for localizing and tracking devices at distances up to several hundred meters.
IC Substrates vs. UHDI: The Future of Interconnect
03/15/2026 | Marcy LaRont, I-Connect007Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.