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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals
December 15, 2015 | IPCEstimated reading time: 2 minutes
These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.
Supplier Declaration
The 2-18h Conflict Minerals Declaration Task Group discussed potential future changes and enhancements to IPC-1755. The committee discussed the use of special characters in smelter names and potential revisions to some of the declaration questions in order to improve clarity and usability. The committee decided to meet monthly work towards publishing a revision of the standard in 2017.
Environment, Health, and Safety
The 4-33 Halogen Free Laminate Materials Subcommittee reviewed what comments from this subcommittee, if any, would be helpful in steering the U.S. EPA in its TSCA work plan to study Tetrabromobisphenol A (TBBPA). Fern Abrams was able to lend some sanity to the discussion and the subcommittee decided to wait for the IPC-constructed comments that will be submitted to the EPA.
Management
The 8-41 Technology Roadmap Subcommittee discussed ways to improve the IPC International Technology Roadmap for Electronic Interconnection and to increase its reach to the greater electronics manufacture industry. From this brainstorming session, the group will strategize the continual awareness of the 2015 version and enhancements which can be made to the 2017 version.
Embedded Devices
Based on significant feedback following publication of IPC-7092, Design and Assembly Process Implementation for Embedded Components, the D-55 Embedded Devices Process Implementation Subcommittee is beginning work on an amendment or A revision of the standard. The subcommittee will make a decision on the best route to take IPC-7092 based on the amount of new information or inquiries for expanded topics it receives.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.