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epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting

05/13/2024 | epoxySet
epoxySet   introduces the EC-1015HP epoxy potting compound.  This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies.  As a low viscosity encapsulant, it is used for large and small potting applications with fragile components. 

D Coupon Testing and Data Insights With GreenSource Fabrication

04/17/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.

IPC Publishes Comprehensive Strategy to Address Electronics Industry’s Global Workforce Challenge

04/10/2024 | IPC
One of the most difficult and urgent challenges facing the electronics industry is a chronic shortage of adequately skilled workers. Today, IPC unveiled an expansion of its strategy to address the workforce challenges of the U.S. electronics manufacturing industry and called on its more than 3,000 member companies to join in the effort.

UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium 

03/21/2024 | Anaya Vardya, American Standard Circuits
American Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).

onsemi Aligns Business Groups to Expand Product Portfolio and Accelerate Growth

03/13/2024 | onsemi
onsemi announced the formation of the Analog and Mixed-Signal Group (AMG) which will be led by newly appointed group president, Sudhir Gopalswamy.
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