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Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains

04/22/2026 | PRNewswire
Silicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.

Mitate Zepto Technica Joins JST Edge AI Semiconductor R&D Program as Implementation Partner

04/22/2026 | PRNewswire
Mitate Zepto Technica, Inc., based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST).

Wearable Technology Market Expected to Reach $183.2 Billion by 2031, Growing at a CAGR of 12.75%

04/22/2026 | PRNewswire
According to the report, the global wearable technology market size was valued at USD 54.8 billion in 2020 and is projected to reach USD 183.2 billion by 2031, registering a CAGR of 12.75% from 2022 to 2031.

Camtek Acquires Visual Layer to Strengthen Visual AI Capabilities in Inspection and Metrology

04/21/2026 | Camtek
Camtek Ltd., a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, announced that it has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.

Zhen Ding Board Approves Subsidiary Leading Technology’s Hong Kong Listing Plan

04/20/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced (17th) that its Board of Directors has approved a proposal for its subsidiary, Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd., to apply for a listing on the Hong Kong Stock Exchange.
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