Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Nolan’s Notes: Soldering Technologies
Stadium’s Shanghai Design Centre Pushes Design-led Growth for Wireless Applications
March 11, 2016 | Stadium GroupEstimated reading time: 1 minute
On 16th February 2016, Stadium’s Board of Directors cut the ribbon to signify the official opening ceremony for its Regional Design Centre (RDC) in Shanghai’s Zhangjiang Hi-Tech Park, China.
In support of the Group’s wider strategy to further develop its design-led technology businesses, the Shanghai RDC has become an International Purchasing Office (IPO) and the Company’s regional research and development hub in wireless M2M connectivity for global OEM products in automotive, medical, security and other growing vertical markets. Driven by the Internet of Things (IoT), which continues to stimulate demand, the M2M space is forecast for high growth.
“The new Shanghai Regional Design Centre is an exciting move for Stadium that both strengthens our wireless capabilities and gives us access into new markets,” said Charlie Peppiatt, CEO, Stadium Group. “We have recruited a highly experienced team, including design engineers and field application engineers, specialising in wireless, RF and M2M technologies. Stadium’s presence in China, delivered by the new Shanghai RDC and manufacturing facility in Dongguan, positions the company to capitalise on a growing market opportunity and expand further into the Asia Pacific market.”
A 210 m² site on the Zhangjiang Hi-Tech Park was selected as the location for Stadium’s RDC office. Located on the Pudong side of the city, this high-tech park is host to a large number of industries including integrated circuits, software, IoT development, biopharmaceuticals, information security, semiconductor illumination and modern agriculture, among others. A significant number of multinationals also have their research and development centres located here. The talent pool in Zhangjiang Hi-Tech Park for electronics engineering and related skills is the best in Asia with a vast pool of experienced skilled doctorates and graduates.
Share on:
Suggested Items
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.