-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Stadium’s Shanghai Design Centre Pushes Design-led Growth for Wireless Applications
March 11, 2016 | Stadium GroupEstimated reading time: 1 minute

On 16th February 2016, Stadium’s Board of Directors cut the ribbon to signify the official opening ceremony for its Regional Design Centre (RDC) in Shanghai’s Zhangjiang Hi-Tech Park, China.
In support of the Group’s wider strategy to further develop its design-led technology businesses, the Shanghai RDC has become an International Purchasing Office (IPO) and the Company’s regional research and development hub in wireless M2M connectivity for global OEM products in automotive, medical, security and other growing vertical markets. Driven by the Internet of Things (IoT), which continues to stimulate demand, the M2M space is forecast for high growth.
“The new Shanghai Regional Design Centre is an exciting move for Stadium that both strengthens our wireless capabilities and gives us access into new markets,” said Charlie Peppiatt, CEO, Stadium Group. “We have recruited a highly experienced team, including design engineers and field application engineers, specialising in wireless, RF and M2M technologies. Stadium’s presence in China, delivered by the new Shanghai RDC and manufacturing facility in Dongguan, positions the company to capitalise on a growing market opportunity and expand further into the Asia Pacific market.”
A 210 m² site on the Zhangjiang Hi-Tech Park was selected as the location for Stadium’s RDC office. Located on the Pudong side of the city, this high-tech park is host to a large number of industries including integrated circuits, software, IoT development, biopharmaceuticals, information security, semiconductor illumination and modern agriculture, among others. A significant number of multinationals also have their research and development centres located here. The talent pool in Zhangjiang Hi-Tech Park for electronics engineering and related skills is the best in Asia with a vast pool of experienced skilled doctorates and graduates.
Suggested Items
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.