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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Matrix's NEW Hakuto Dry Film Laminator Impresses at IPC
April 14, 2016 | MatrixEstimated reading time: 1 minute
Matrix is delighted with customer reaction at last month’s North American IPC unveiling of the new Hakuto Mach 630NP/6630NP Series Dry Film Laminators and is now ready to provide Sales and Service to all regions of North America.
During the recent APEX/IPC Show in Las Vegas, customers were amazed at the new and Innovative technology such as changing rolls in a matter of seconds.
Matrix believes the NEW Hakuto Mach 630NP Dry Film Laminator will change the game for PCB manufacturing.
Fred Long, Matrix Business Development says: “The new Mach 630NP machine addresses the accuracy needed to assist in the transfer of very fine lines on the latest HSLL laminates using Super Low Profile Copper surfaces. This is made possible by the new Lamination Module with its EVEN Heat and EVEN Pressure across the entire surface of the laminated panel. In addition, the ability to change the rubber lamination rolls in seconds will not only increase productivity but will also offer alternative “quick change” rubber solutions for different product needs. The complete redesign of the film lamination approach will now begin to reach the most important users of this latest technology. Matrix is eager to show manufacturers that by using the new system, Productivity and Yield will now surpass all traditional ROI expectations.”
See the PCB007 IPC Interview with Dan Feinberg and Fred Long discussing the new laminating machine and its innovative features, click here.
During the next few weeks, Matrix is scheduled to place additional machines in three specific regional areas in the US. Customers will then be able to travel to these sites and see the machines in operation.
About Matrix USA Inc.
Committed to the motto, “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.
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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.