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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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EIPC to Hold Workshop on Reliability of Multilayer PCBs
July 26, 2016 | EIPCEstimated reading time: Less than a minute
A special one-day seminar will be run by the European Institute of Printed Circuits (EIPC) on September 22, 2016 at Amphenol Invotec in Tamworth, Staffordshire, England. The seminar will focus on one very important issue – how to measure safety, quality and reliability of multilayer PCBs.
Quality in PCB fabrication is essential to avoid any liability issues. Documentation of quality is not only a paper exercise which states that you are perfectly capable to manufacture according to certain standard. There is a real need to understand the quality of the fabricated PCB, and it needs to be measured.
How this is done will be demonstrated at this workshop, at which participants will learn and see the following:
- What is measured, and how.
- How this will be done at the PCB fabricator or at an independent test house.
- What measurements mean in terms of reliability and product life expectancy.
- The establishment of a high level of product confidence in your supply chain.
To know more about the workshop program, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
03/26/2025 | EIPCThe European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland.
EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
12/31/2024 | EIPCThe European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.