-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Alpha to Present Technical Paper on Low Voiding High Reliability Solder Paste at IPC Technical Conference in India
September 1, 2016 | Alpha Assembly SolutionsEstimated reading time: 3 minutes
Alpha Assembly Solutions will be presenting a technical paper titled “Low Voiding High Reliability Solder Paste for Automotive, LED and other Demanding Applications” at the IPC India Technical Conference to be held on September 22, 2016.
Electronic assemblies used in automotive, telecommunications, high power LEDs, and other demanding applications require soldering materials that can withstand high temperature, vibration, thermal shock and other harsh conditions. For example, electronics in automotive applications typically require enhanced vibration and thermal cycling performance. Assemblies in telecommunications require enhanced thermal cycling, while assemblies in lighting (high power LEDs) require creep-resistant material at high operating temperatures.
In order to meet these various demanding applications, a new high reliability, RoHS-compliant alloy was developed. This paper will cover the reliability properties of the new alloy. Further, a new halogen-free flux vehicle system was optimized for this alloy. Following this, case studies for two applications, Automotive and LED Lighting, are covered in this paper.
IPC India Technical Conference
Date: Thursday, September 22, 2016
Time: 10:50am – 11:15am
Venue: Bangalore International Exhibition Centre
10th Mile, Tumkur Road, Madavara Post, Dasanapura Hobli, Bengaluru, Karnataka 562123, India
Topic: Low Voiding High Reliability Solder Paste for Automotive, LED and other Demanding Applications
Presented by: Richard Puthota, Business Development Director of Alpha Assembly Solutions
To learn more about Alpha Assembly Solutions’ vast product offering and capabilities, please visit our website at AlphaAssembly.com
Speaker Biography
Richard Puthota is a Director of Business Development & Technical Support at Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, where he is responsible for Alpha’s Business & Technical Support in India, Africa, Sri Lanka & Middle-East. Being a process specialist (both in bare board manufacturing &board assembly) he undertakes process audits for OEMs, EMS and train & Certify Management staff. He adds sustainable & tangible value to Alpha’s customers across the Indian subcontinent. Recently, he received the “President Award for the year of 2014” for creating an entire business model for sales, distribution channels & branding which led to share gain and continued growth in South Africa, a new market for the business.
Richard has over 31 years experience in PCB assembly industry. He holds BS Chemical Technology and PGD in Applied Chemistry from Loyola College and Executive Education from IIM-Bangalore. Richard currently serves as Member of Corporate Advisory Board of SRM University, Industrial Advisory Committee of Loyola College and also Advisory Panel of India’s Electronics Magazines
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.