Complex Materials Can Self-organize into Circuits, May Form Basis for Multifunction Chips
September 16, 2016 | ORNLEstimated reading time: 2 minutes
Researchers studying the behavior of nanoscale materials at the Department of Energy’s Oak Ridge National Laboratory have uncovered remarkable behavior that could advance microprocessors beyond today’s silicon-based chips.
The study, featured on the cover of Advanced Electronic Materials ("Chip Architectures: Multimodal Responses of Self-Organized Circuitry in Electronically Phase Separated Materials"), shows that a single crystal complex oxide material, when confined to micro- and nanoscales, can act like a multi-component electrical circuit. This behavior stems from an unusual feature of certain complex oxides called phase separation, in which tiny regions in the material exhibit vastly different electronic and magnetic properties.
It means individual nanoscale regions in complex oxide materials can behave as self-organized circuit elements, which could support new multifunctional types of computing architectures.
An study found that complex oxide materials can self-organize into electrical circuits, which creates the possibility for new types of computer chips
An ORNL study found that complex oxide materials can self-organize into electrical circuits, which creates the possibility for new types of computer chips.
“Within a single piece of material, there are coexisting pockets of different magnetic and/or electronic behaviors,” said ORNL’s Zac Ward, the study’s corresponding author. “What was interesting in this study was that we found we can use those phases to act like circuit elements. The fact that it is possible to also move these elements around offers the intriguing opportunity of creating rewritable circuitry in the material.”
Because the phases respond to both magnetic and electrical fields, the material can be controlled in multiple ways, which creates the possibility for new types of computer chips.
“It’s a new way of thinking about electronics, where you don’t just have electrical fields switching off and on for your bits,” Ward said. “This is not going for raw power. It’s looking to explore completely different approaches towards multifunctional architectures where integration of multiple outside stimuli can be done in a single material.”
As the computing industry looks to move past the limits of silicon-based chips, the ORNL proof-of-principle experiment shows that phase separated materials could be a way beyond the “one-chip-fits-all” approach. Unlike a chip that performs only one role, a multifunctional chip could handle several inputs and outputs that are tailored to the needs of a specific application.
“Typically you would need to link several different components together on a computer board if you wanted access to multiple outside senses,” Ward said. “One big difference in our work is that we show certain complex materials already have these components built in, which may cut down on size and power requirements.”
The researchers demonstrated their approach on a material called LPCMO, but Ward notes that other phase-separated materials have different properties that engineers could tap into.
“The new approach aims to increase performance by developing hardware around intended applications,” he said. “This means that materials and architectures driving supercomputers, desktops, and smart phones, which each have very different needs, would no longer be forced to follow a one-chip-fits-all approach.”
Suggested Items
Real Time with... IPC APEX EXPO 2024: Sustainability in the Industry
04/26/2024 | Real Time with...IPC APEX EXPOGuest Editor Henry Crandall and Chris Nash of Indium Corporation discuss the company's 90th anniversary and its focus on sustainability. They focus on the benefits of sustainable materials, their compatibility, and value propositions. The conversation also highlights how Durafuse LT technology's role in reducing reflow temperatures is leading to significant cost and energy savings. Nash also touches on downstream sustainability efforts such as using recycled materials for packaging.
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building
04/12/2024 | Newccess IndustrialOn a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry.
The Need for a Holistic Global Sustainability Standard
04/10/2024 | Michael Ford, Aegis SoftwareNo one can deny that the resources of our fragile planet are finite. The environment seems like a third party, subject to constant degradation. We’re acutely aware of the effects of pollution on our climate, and despite our “throw-away” culture, recycling and recovery of materials has remained relatively expensive, even as we use more energy just to survive.
iNEMI Publishes Four Roadmap Topics
04/04/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.