-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Sensible Design: Conformal Coatings - Beware the Boards that ‘Bare’ All!
September 21, 2016 | Phil Kinner, ElectrolubeEstimated reading time: 2 minutes

This month, I’m going to depart from my usual format of providing five essential facts about conformal coatings. Instead, I’m going to provide an account of a customer’s problem—no company names mentioned, of course—that brought into question the adhesion performance of a coating that they had been using successfully for some time.
This problem, and its eventual solution, illustrates rather well how good record-keeping, batch traceability, and the auditing of suppliers for quality control compliance can go a long way to help resolve manufacturing issues.
Always up for a challenge, and not wanting to ignore any production-related issue that appeared to cast a shadow over the performance of our products, we donned our detective hats and, with spyglasses at the ready, set about to discover the causes of this particularly challenging delamination problem. But first, let’s have a little bit of background.
Our customer—a multinational firm with sites around the world—contacted us about a coating they had been using without any problems for quite some time, but for some bizarre reason was “no longer sticking” to their boards. They reported that a newly delivered batch of this conformal coating, when applied, could be peeled from the solder mask areas in a single sheet. Our preliminary queries revealed that there had been no changes made to the coating process itself. So, was the coating at fault, or was there something else we were missing?
Delving a little deeper, we discovered that our customer was using this batch of coating material at several of its sites, both within the same country as the problem site, as well as sites located in other countries. It turned out these other sites had no issues to report regarding the coating, and they confirmed that they were experiencing neither the delamination problems we were investigating, nor indeed any problems related to a lack of adhesion. It was time to check the records.
Following a search through their database, the customer discovered they had coated four different styles of boards using the same batch of conformal coating material. Significantly, however, all of the adhesion issues were confined to a single board style. Moreover, these adhesion issues were first reported and recorded at about the same time.
On checking the serial numbers of the coated boards, it became apparent that the adhesion issues all began on a batch of bare boards that had been obtained from a new vendor as part of a cost-cutting measure. Samples of these incoming bare boards were subsequently analysed and found to have a surface energy of 26 dyne/cm (i.e., much, much less than the 40 dyne/cm level recommended for good adhesion).
Our customer then decided that perhaps it was high time to audit the new board supplier. During this process, they found many corners had been cut to save time and money, but two things, in particular, stood out. Firstly, the board shop was performing multiple passes through a UV oven to “cure” the solder resist, instead of the single recommended UV pass and a secondary thermal bake. Secondly, the auditor noted a “shiny film” floating on the surface of the rinse bath during the final rinse process.
To read this entire article, which appeared in the August 2016 issue of The PCB Design Magazine, click here.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.