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The Shaughnessy Report: Silicon to Systems—The Walls Are Coming DownPADS Paper: Solving High-Speed Design Challenges with DRC
September 28, 2016 | Mentor GraphicsEstimated reading time: Less than a minute
Coping with signal integrity (SI) and electromagnetic interface (EMI) issues are a daily challenge for PCB design engineers. Avoid end-product problems, such as emissions testing failures or signal-integrity-related failures, by using design rule checks (DRCs).
This PADS paper reviews the common causes of SI/EMI challenges and how they can be easily identified.
Click here to download.
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