Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
ESD Alliance: EDA Industry, PCB Revenue Grew in Q2 2016
September 29, 2016 | PRNewswireEstimated reading time: 3 minutes
The Electronic System Design (ESD) Alliance (formerly EDAC) Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 5.6% for Q2 2016 to $2.0 billion, compared to $1.9 billion in Q2 2015. The four-quarters moving average, which compares the most recent four quarters to the prior four quarters, increased by 3.6%.
"Industry revenue reflected solid growth in Q2, including increases in the Americas and double-digit increases in Asia-Pacific andJapan," said Walden C. Rhines, board sponsor for the ESD Alliance MSS and chairman and CEO of Mentor Graphics. "Product categories CAE, Semiconductor IP, IC Physical Design & Verification, and PCB & MCM all reported increases this quarter."
Companies that were tracked employed a record 34,988 professionals in Q2 2016, an increase of 6.7% compared to the 32,806 people employed in Q2 2015, and up 1.4% compared to Q1 2016.
The complete quarterly MSS report, containing detailed revenue information broken out by both categories and geographic regions, is available to members of the ESD Alliance.
Revenue by Product Category
Computer Aided Engineering (CAE), generated revenue of $662.4 million in Q2 2016, which represents an 0.8% increase compared to Q2 2015. The four-quarters moving average for CAE decreased 1.3%.
IC Physical Design & Verification revenue was $415 million in Q2 2016, a 9.4% increase compared to Q2 2015. The four-quarters moving average increased 4%.
Printed Circuit Board and Multi-Chip Module (PCB & MCM) revenue of $167.8 million for Q2 2016 represents an increase of 8.1% compared to Q2 2015. The four-quarters moving average for PCB & MCM increased 0.2%.
Semiconductor Intellectual Property (SIP) revenue totaled $668 million in Q2 2016, a 9.2% increase compared to Q2 2015. The four-quarters moving average increased 10.3%.
Services revenue was $99.4 million in Q2 2016, a decrease of 3.6% compared to Q2 2015. The four-quarters moving average decreased 0.9%.
Revenue by Region
The Americas, EDA's largest region, purchased $908.4 million of EDA products and services in Q2 2016, an increase of 4.4% compared to Q2 2015. The four-quarters moving average for the Americas increased 2.3%.
Revenue in Europe, the Middle East, and Africa (EMEA) decreased 6.8% in Q2 2016 compared to Q2 2015 on revenues of$284.7 million. The EMEA four-quarters moving average decreased 1.8%.
Second quarter 2016 revenue from Japan increased 15.7% to $211.4 million compared to Q2 2015. The four-quarters moving average for Japan increased 6.6%.
The Asia/Pacific (APAC) region revenue increased to $608.1 million in Q2 2016, an increase of 10.9% compared to the second quarter of 2015. The four-quarters moving average increased 7.6%.
The complete MSS report, available to the ESD Alliance members, contains additional detail for countries in the Asia/Pacificregion.
About the MSS Report
The ESD Alliance Market Statistics Service reports EDA industry revenue data quarterly and is available to Alliance members. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. MSS report data is segmented as follows: revenue type (product licenses and maintenance, services, and SIP), application (CAE, PCB/MCM Layout, and IC Physical Design & Verification), and region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific), with many subcategories of detail provided. The report also tracks total employment of the reporting companies.
About the ESD Alliance
The Electronic System Design Alliance (ESD Alliance) is an international association of companies that provide goods and services that are the foundation of the semiconductor design ecosystem. This ecosystem encompasses all of the activities required to create a semiconductor design and associated hardware and software for manufacturing and delivery of new electronic products.
Member companies include developers and suppliers of EDA, semiconductor IP, embedded software, packaging, PCB/interconnect and others. Collectively, they provide the software, services, intellectual property and hardware needed to design and verify semiconductors, associated software, packaging and interconnect technologies for the manufacturing of these products. Markets served by these products range from computers, communications, networking, medical and industrial equipment, automotive electronics, and consumer electronics to emerging markets such as the Internet of Things (IoT).
Share on:
Suggested Items
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future
04/24/2025 |Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.
Driving Sustainability in PCB Design
04/24/2025 | Marcy LaRont, I-Connect007Filbert (Fil) Arzola is an electrical engineer at Raytheon. He’s smart, entertaining, and passionate about PCB design. As it turns out, he’s also passionate about “Mother Earth,” as he calls her. Born and raised in Southern California, he freely admits that he turns the water off when he brushes his teeth and yells at his brother for throwing batteries in the garbage. But when looking at the issue of sustainability and PCB design, he urges his audiences to ponder what sustainability looks like. Can PCB designers, he asks, make any impact on sustainability at all?
Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs
04/24/2025 | Marcy LaRont, I-Connect007At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.