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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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How Good Design Enables Sustainable PCBs
August 21, 2025 | Gerry Partida, Summit InterconnectEstimated reading time: 1 minute
Sustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing.
Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products. Let’s explore how adhering to design rules can directly contribute to sustainability and why poor designs can derail these efforts.
The Hidden Cost of Bad Design
Poorly designed PCBs often result in low manufacturing yields, leading to higher scrap rates. For every lot that fails, manufacturers must remake boards, consuming additional materials, energy, and manpower. This cycle not only increases production costs but also amplifies the environmental footprint of each PCB produced.
For example, a design with inadequate annular rings or insufficient conductor or plane clearances may cause defects such as open circuits or shorts. Badly conceived or overly complex HDI stackups can lead to registration issues, delamination, and other non-compliances. These issues often require rework or remakes, both resource-intensive processes. The wasted copper, laminate, chemicals, and labor could have been avoided with a well-structured, IPC-compliant design.
Identifying Design Issues: Tools and Missed Opportunities
The industry has developed advanced tools to identify design issues early in the process, offering the potential to correct problems before manufacturing begins. PCB design tools like Siemens NPI (New Product Introduction) and fabrication tools like Genesis InSight or Integr8tor allow engineers to perform detailed design rule checks (DRCs) and manufacturability analyses. These tools highlight potential risks in the design, such as misaligned drill files, inadequate copper-to-edge clearances, and poorly optimized stackups.
To continue reading this article, which originally appeared in the August 2025 edition of Design007 Magazine, click here.
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A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.