Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
August 26, 2025 | I-Connect007Estimated reading time: 1 minute
In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
The Optimize the InterconnectSM series explores how MKS’ ESI is redefining microvia formation for today’s most advanced HDI PCB and substrate designs.
A downloadable companion guide provides a deeper technical dive into the unified via formation methodology, featuring case studies that demonstrate the measurable benefits of OTI.
Stay tuned—new episodes launch every other Thursday!
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