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Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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EIPC SpeedNews: News from the European PCB Industry
October 4, 2016 | EIPCEstimated reading time: Less than a minute
- Review EIPC Reliability Workshop, Tamworth
- What do EMS Providers Sanmina, Eolane, Asteelflash, BMK and Prettl have in common?
- Save the date: EIPC Winter Conference Salzburg, February 2 & 3, 2017
- Digitaltest Germany's success continues with new, expanded production site
- SOMACIS at electronica 2016
- Cicor presents: DenciTec – a PCB technology that takes miniaturization to the next level
- Senior industrial engineers join Loughborough University's teaching staff. One of them is Prof. Martin Goosey
- ICT Harrogate Winter Seminar 2016
- Inaugural 'ScoopTalk' Takes Event Video to the Next Level
- Ventec International appoints Denis McCarthy Jr. as technical sales account manager
- Seica SpA participation at Electronica, Munich, November 8–11, 2016
- News from IPC
Suggested Items
Hot Off the Press: Explore the New Issue of IPC Community
01/14/2025 | IPC Community Editorial TeamThe latest digital copy of IPC Community, is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members. Find stories on IPC student leadership, successful women in business, the trouble with tariffs, the inside workings on an IPC mentorship duo, standards updates, and so much more.
IPC Announces New Training Course: PCB Design for Manufacturability
01/10/2025 | IPCThis three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.
TRI Launches 3D AXI Platform with Clearer Imaging
01/10/2025 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600FB SII system, designed to deliver clearer imaging.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
Marcy LaRont Named I-Connect007 Executive Director
01/08/2025 | IPCMarcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022.