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Silicon Valley Designers Council Chapter Meeting Oct. 13
October 5, 2016 | Silicon Valley IPC Designers CouncilEstimated reading time: Less than a minute
Join the Silicon Valley IPC Designers Council at TTM San Jose for an educational "Lunch 'n Learn" meeting on October 13 from 11:30 am to 1:30 pm. Speaker Julie Ellis, field applications engineer with TTM Technologies, will discuss “Printed Circuit Board Cost-Adders.”
A designer is faced with many challenges when planning their printed circuit board to achieve a balance of performance, quality and reliability versus cost. Unfortunately, the cost of a printed circuit board increases with size, thickness, number of layers, features, and technical difficulty.
Throughout this presentation, Julie will discuss basic design guidelines for standard production—as opposed to advanced capabilities—and how they affect the number of required processes and, therefore, cost. She will also discuss costs related to material utilization, fixed premiums for smaller lines/spaces and tolerances, and variable costs of high speed materials, drilling, and multiple lamination cycles. Lastly, Julie will show increasingly complex stack-ups to demonstrate how cost factors relate to the additional processes. You will learn the correlation between requirements and costs to help you make better design choices.
To RSVP, click here.
Location:
TTM San Jose
340 Turtle Creek Court
San Jose, CA 95125
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.